Selectivity in copper chemical vapor deposition

نویسندگان

  • Susan L. Cohen
  • Michael Liehr
چکیده

The fundamental surface chemistry underlying selectivity in copper chemical vapor deposition (CVD) from COD-Cu-hfac and Cu(hfac), has been determined. Both electronic and chemistry contributions strongly influence the precursor reactivity on oxide as compared to metal surfaces. These results have important implications regarding the role of surface preparation and cleaning for initiating and maintaining selective deposition.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Evaluation of Vapor Deposition Techniques for Membrane Pore Size Modification

The suitability of three vapor deposition techniques for pore size modification was evaluated using polycarbonate track etched membranes as model supports. A feature scale model was employed to predict the pore geometry after modification and the resulting pure water flux. Physical vapor deposition (PVD) and pulsed plasma-enhanced chemical vapor deposition (PECVD), naturally, form asymmetric na...

متن کامل

Tunnel oxide passivated rear contact for large area n-type front junction silicon solar cells providing excellent carrier selectivity

Carrier-selective contact with low minority carrier recombination and efficient majority carrier transport is mandatory to eliminate metal-induced recombination for higher energy conversion efficiency for silicon (Si) solar cells. In the present study, the carrier-selective contact consists of an ultra-thin tunnel oxide and a phosphorus-doped polycrystalline Si (poly-Si) thin film formed by pla...

متن کامل

Simulation of the gas-phase processes in remote-plasma-activated chemical-vapor deposition of silicon dielectrics using rare gas--silane-ammonia mixtures

Remote-plasma-activated chemical-vapor deposition (RPACVD) is a method whereby thin films are deposited with the substrate located out of the plasma zone. The lower rate of energetic ion and photon bombardment in RPACVD compared to conventional direct-plasma-enhanced chemical-vapor deposition (DPECVD) reduces damage to the substrate. The use of RPACVD also enables one to more carefully tailor t...

متن کامل

Pulsed plasma- Used injection sources for remote plasma activated chemical vapor deposition

Remote plasma activated chemical vapor deposition (RPACVD) is an attractive fabrication technique owing to the increased selectivity of radical generation which can be obtained compared to deposition techniques in which the substrate is immersed in the plasma. This selectivity can be compromised if the deposition gases, which are typically injected downstream of the plasma zone, back-diffuse in...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 1999